Tool for Wire Bonding (Ball Bonding)
New Equipment | Assembly Services
Suitable for wire bonder OEM service available.Factory price. Contact: yoyogong@yehengdz.com
Career Center | San Diego, California USA | Engineering
MeltroniX is a supplir of MCM/hybrids for the military and space market. We are seeking a process engineer with expertise in wire bonding, including ultrasonic and thermocompession technology.
Technical Library | 2017-08-31 13:43:48.0
Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Proper optimization of wire bond parameters and machine settings are essential for good yields. Wire bond process can generate a variety of defects such as lifted bond, cracked metallization, poor intermetallic etc. NSOP – non-stick on pad is a defect in wire bonding which can affect front end assembly yields. In this condition, the imprint of the bond is left on the bond pad without the wire being attached. NSOP failures are costly as the entire device is rejected if there is one such failure on any bond pad. The paper presents some of the failure modes observed and the efforts to address NSOP reduction
This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
