New Equipment | Assembly Services
KULICKE & SOFFA 1419-3- WIRE BONDER PART MACHINE
Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, K&S WB1
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, K&S WB2
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, K&S WB3
Used SMT Equipment | Semiconductor & Solar
Wire Bonder, Gold Wire, Nr. 1