The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia
Industry Directory | Manufacturer / Manufacturer's Representative
Sales/Marketing, Manufacturers Representatives, Used Equipment Sales
3D Printers Rapid Prototyping Equipment Semiconductor Equipment - Rework Stations - Wire Bonders - Palomars, Orthodyne, Delvotec
Used SMT Equipment | Chipshooters / Chip Mounters
(3) Fuji CP743E Chipshooters; 2003 - 2004 vintage. All consigned into the High Technology Exchange on March 12-14 on www.xlineassets.com List of additional equipment includes: TEST AND MEASUREMENT: Advantest Spectrum Analyzers Rhode and Schwa
Industry News | 2013-06-07 14:37:14.0
Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
Industry News | 2013-03-06 10:33:14.0
Hesse Mechatronics (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Industry News | 2013-03-06 10:36:50.0
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, formally announces the company's recent name change from Hesse & Knipps, Inc. to Hesse Mechatronics, Inc., effective January 1, 2013.
Front End: Previously owned (new & used) equipment used for fabrication of semiconductor wafers and similar devices. Includes coater/developers, CVD, PECVD, etch tools, steppers, sputtering tools, ashers, evaporators. Back End: Previously owned (
Industry Directory | Manufacturer / Other
More than 17 years manuafacture experience in designing,producing of wire bonding tools- wire guide,cutter,wedge,clamp finger,and OEM seivice available.ISO 9001approved and CE SGS certificated.Selfowned patent.
Industry News | 2012-09-04 08:51:32.0
Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.
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