Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
New Equipment | Surface Finish
Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed
Industry News | 2016-09-23 15:16:53.0
NEO Tech announced that its highly miniaturized electronic manufacturing capabilities are being deployed in advanced implantable devices and electroceuticals for the medial industry.
Industry News | 2012-09-10 19:45:44.0
San Francisco Circuits is now offering Micro-Circuits.
Industry News | 2012-09-10 20:15:43.0
San Francisco Circuits will be exhibiting at PCB West 2012.
Used SMT Equipment | Wire Harness Testers
we need used wire Bond ; K &S Type：ICONNX CONNX LED Any thing for selling pls noted me
For Wire Bonding with follow types; Au Wire Al Wire Cu Wire
Industry News | 2003-05-05 09:13:55.0
Reliable Wire Bonders for High Yield Production
Suppliers Of Microelectronics & PCB Assembly Equipment & Materials, including die bond, wire bond & test & SMT screen printers & pick and place systems.
Industry News | 2024-10-06 19:41:20.0
NEOTech is excited to announce the recent implementation of an enhanced wire bonding manufacturing process for microelectronics circuit assemblies. This innovative process significantly increases production yields while reducing the production cycle time for each assembly. NEOTech remains committed to continuous improvements, particularly in the manufacturing of extraordinarily high-tech microelectronics products for the nation's leading OEMs in the Aerospace & Defense, Medical Device, and Industrial markets. As part of this commitment, NEOTech has researched, tested, and qualified an advanced wire bonding technique known as Standoff Stitch (SOS), which further reinforces the company's dedication to delivering high-quality, precision-driven solutions.
