Technical Library | 2014-05-08 16:34:16.0
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate.
Industry News | 2015-06-18 17:55:13.0
Indium Corporation and the Empire Chapter of the International Microelectronics Assembly and Packaging Society (IMAPS), in association with the State University of New York (SUNY), will host an Advanced Technology Workshop and Tabletop Exhibition on Advances in Semiconductor Packaging on Sept. 24 at SUNY Polytechnic Institute in Marcy, N.Y.
Technical Library | 2023-01-10 20:08:36.0
Nickel corrosion in ENIG and ENEPIG is occasionally reported; when encountered at assembly it manifests as soldering failures in ENIG and wire bond lifts in ENEPIG. Although not common, it can be highly disruptive, resulting in missed deliver schedules, supply chain disruption, failure analysis investigations, and liability - all very costly.
Technical Library | 2014-12-11 18:00:09.0
The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly processes. Wire bonded packages using conventional copper lead frame have been used in industry for quite some time. However, the demand for consumer electronics is driving the need for flip chip interconnects as these packages shorten the signals, reduce inductance and improve functionality as compared to the wire bonded packages. The flip chip packages have solder bumps as interconnects instead of wire bonds and typically use an interposer or organic substrate instead of a metal lead frame (...) The paper provides a general overview of typical defects and failure modes seen in package assembly and reviews the efforts needed to understand new failure modes during package assembly. The root cause evaluations and lessons learned as the factory transitioned to thin form factor packages are shared
Technical Library | 2012-11-01 20:54:49.0
First published in the 2012 IPC APEX EXPO technical conference proceedings. The continuous progression toward portable, high frequency microelectronic systems has placed high demands on material performance, notably low dielectric constants (Dk), low loss tangent (Df), low moisture uptake, and good thermal stability. Epoxy resins are the workhorses of the electronic industry. Significant performance enhancements have been obtained through the use of PPE telechelic macromonomers with epoxy resins. However, there is a ceiling on the performance obtainable from epoxy-based resins. Therefore, non-epoxy based dielectric materials are used to fulfill the need for higher performance.
Industry News | 2024-07-01 11:39:12.0
ViTrox Americas Inc. is proud to announce the opening of its new demo lab in Hutto, Texas. This cutting-edge facility is now ready for demonstrations and evaluations, showcasing ViTrox's latest innovations in 3D inspection technology. The demo lab is designed to offer an immersive and hands-on experience, allowing customers to interact with ViTrox's latest innovations and understand how these solutions can enhance their quality control and inspection processes.
Industry News | 2021-01-28 01:09:48.0
Billings among North American manufacturers of semiconductor production equipment grew 2.6% sequentially and 7.6% on year in December 2020, according to SEMI.
Industry News | 2006-12-04 11:56:21.0
November 30, 2006
Industry News | 2023-06-07 19:47:49.0
Pemtron Technology is pleased to announce the addition of Fabio Pareira to its engineering team. With more than 20 years of experience in Surface Mount Technology (SMT) processes, Fabio brings a wealth of expertise to Pemtron's operations in Brazil. His extensive knowledge in SMT equipment, process optimization, and product quality will further enhance Pemtron's ability to deliver innovative solutions to its customers.
Industry News | 2023-01-16 07:24:10.0
Pemtron Technology is pleased to announce that the company has added direct support in Canada. In addition to its local manufacturers' representative, BROCK Electronics, the company has hired a specialized printed circuit board assembly (PCBA) technician with extensive hands-on experience based in Toronto, Canada.
