Full Site - : wire bonding in microelectronics (Page 4 of 19)

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:50:57.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:56:07.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Digicom Electronics Incorporates Nitrogen in Soldering and Reflow Processes to Maximize Device Reliability

Industry News | 2016-10-06 10:10:53.0

Digicom Electronics now generates its own nitrogen to use in its solder reflow, selective soldering, and hand soldering manufacturing processes to strengthen the bonds and improve solder adhesion. Adding nitrogen minimizes device failure and ensures printed circuit board integrity, especially for mission critical products for the medical, military and aerospace, industrial, and RF wireless industries. The addition of nitrogen is part of Digicom's Diamond Track Manufacturing Processes.

Digicom Electronics

Experts from Nordson DAGE and Nordson YESTECH to Present at Joint Cleaning Workshop in Dallas

Industry News | 2013-05-28 18:17:42.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that Hal Hendrickson and Scott Robertson will present at a joint cleaning and reliability workshop held in cooperation with Aqueous Technologies, Kyzen and FCT Assembly.

Nordson DAGE

Techcon introduces the TS9800 Series Jet Valve for improved speed and productivity in electronics manufacturing

Industry News | 2019-10-21 16:33:11.0

Techcon is pleased to announce the launch of its new TS9800 Series Jet Valve Dispensing System that includes the TS9800 Piezo-actuated jet valve and TS980 Smart Controller. Unlike pneumatic jet valves and other contact dispensing solutions, the TS9800 Jet Valve utilizes Piezo, non-contact jetting technology for increased speed and reduced scrap during the dispensing process. 

Techcon Systems

Glenbrook Technologies Donates MXRA (Mail X-ray Analyzer) System To Law Enforcement Agencies in Morris County, NJ.

Industry News | 2002-01-30 14:06:35.0

Glenbrook Technologies announced today that through the efforts of Mayor and Freeholder Frank Dreutzler and Morris County Administrator Jim Rosenberg, they are donating the use of their patented, mail X-ray screening technology to law enforcement agencies in Morris County, NJ.

Glenbrook Technologies

Heraeus Electronics Hosts ALL2GaN Event Showcasing Advances in High-Efficiency Power Electronics

Industry News | 2024-04-03 07:36:16.0

Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau. This event will focus on the groundbreaking developments in high-efficiency power electronics, particularly focusing on the capabilities of GaN chips to revolutionize the industry with higher efficiency, power density, and smaller sizes.

Heraeus

MARTIN to Participate in Package on Package (PoP) Design and Assembly Center SMTA International 2012

Industry News | 2012-09-10 09:15:27.0

MARTIN will be one of nine companies participating in the Package on Package Design and Assembly Center (PoP Center) at SMTA International this year.

Finetech

BTU Hires New Rep Firm in SoCal to Close the Loop

Industry News | 2022-07-31 19:39:42.0

BTU International, Inc. today announced the appointment of Closed Loop Technology, Inc. as its manufacturers' representative in Southern California.

BTU International

Adept Technology V.P. of Business Development to Speak At Strategies in Optical Manufacturing Conference

Industry News | 2002-04-22 08:51:24.0

Presentation to Address Challenges in Optoelectronics and Photonic Components Manufacturing

Adept Technology Inc.


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