Full Site - : wire bonding plasma clean (Page 6 of 33)

Nordson MARCH MesoSPHERE Plasma Systems Enable Very High Throughput Processing for 3D and Wafer-level Package Assembly

Industry News | 2018-02-01 20:18:01.0

Nordson MARCH introduces the MesoSPHERE™ Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level -handling wafers up to 450mm and panels up to 480mm. The MesoSPHERE's new, patented W3 three-axis symmetrical plasma chamber ensures that all areas of the wafer are treated equally and uniformly. Tight control over all process parameters gives highly repeatable results.

MARCH Products | Nordson Electronics Solutions

TITAN TIMEPRODUCTS LTD - TTPL

Industry Directory | Manufacturer

TTPL is a reputed EMS(Electronic Manufacturing Service) company offering PCBA, testing and box build on turnkey basis. Certified to ISO/TS16949, TTPL has been offering assembly services at superior quality since 1992.

Microelectronic Assembly Technician - Colorado

Career Center | Boulder, Colorado USA | Engineering,Production,Quality Control

Senior-level micro-electronic technician capable of independent manufacture of custom hybrids, focal plane assemblies, and prototype detector assemblies in cleanroom environment (in Advanced Packaging and Detector Laboratory). MINIMUM QUALIFICATIONS

Ball Aerospace & Technologies Corp.

MPIQC

Industry Directory | Manufacturer

MPIQC is an Electronic Manufacturing Services (EMS) company. Our services are provided at the highest standards to be recognized as a global leader in OEM optimization in IPC Class 2 & Class 3 manufacturing.

ANDA Receives Editor's Choice Award for New Dispensing & Assembly System

Industry News | 2020-10-31 10:23:51.0

Anda Technologies announces that it was awarded two 2020 Mexico Technology Awards. The company received one in the category of Conformal Coating for its iCoat-6 High Precision Selective Conformal Coating. It also received Editor's Choice for the PDCA Series Multi-function Dispensing and Assembly System. The awards were announced during a Virtual Awards Ceremony on Monday, October 26, 2020.

Anda Automation Pte Ltd

Anda Receives Two Mexico Technology Awards at SMTA Guadalajara

Industry News | 2022-09-26 07:07:07.0

Anda Technologies is pleased to announce that it received two 2022 Mexico Technology Awards in the categories of Editor's Choice for its ADA Series and Conformal Coating Equipment for its iCoat-5. The awards were announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.

Anda Automation Pte Ltd

Anda Awarded Best Product – Asia and Best Conformal Coating Equipment at SMTAI

Industry News | 2022-11-07 19:47:11.0

Anda Technologies is pleased to announce that it received two 2022 GLOBAL Technology Awards in the categories of Best Product – Asia for its ADA Series, and Conformal Coating Equipment for its iCoat-5. The awards were announced during a ceremony that took place Wednesday, Nov. 2, 2022 during SMTA International.

Anda Automation Pte Ltd

Anda Technologies Receives 2024 NPI Award for Setting a New Standard in Smart Manufacturing

Industry News | 2024-03-26 13:44:55.0

Anda Technologies is proud to announce that its ADA Series Smart Manufacturing Platform has been honored with the prestigious 2024 CIRCUITS ASSEMBLY NPI Award in the category of Automation Tools. With its unrivaled flexibility, precision, and integrated processes, the ADA Series sets a new standard for smart manufacturing solutions.

Anda Automation Pte Ltd

HYDRON® SE 230A

HYDRON® SE 230A

Videos

Water-based, alkaline defluxing for semiconductor electronics HYDRON® SE 230A is a water-based, single-phase cleaning agent specifically developed for the use in dip tank processes. It removes flux residues from a wide range of semiconductor electro

ZESTRON Americas

Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems for Semiconductor Applications

Industry News | 2015-07-01 15:44:06.0

Nordson MARCH, a Nordson company (NASDAQ: NDSN)announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK™ Series, the new series consists of the TrophoSPHERE™ and StratoSPHERE™ plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Both systems support automated handling and processing of round or square wafers and can process thin wafers with or without a carrier, depending upon the wafer thickness.

MARCH Products | Nordson Electronics Solutions


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