Full Site - : wire bonding plasma clean (Page 7 of 33)

BH Electronics Sdn Bhd

Industry Directory | Manufacturer

A pioneer in the Wire Harness industry in the 1980s,Our Core Production consists of Wire Harness and Cable Assembly,Rubber and Small Plastic Molding, PCB Assembly and Complete Finish Product Box Build

Technology Seminars, Inc.

Industry Directory | Consultant / Service Provider

Serving the Educational Needs of Modern Technologies

Breakthrough Concept to Bond Circuit Board Jumper Wires

Industry News | 2008-11-12 20:09:45.0

November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.

Circuit Technology Center, Inc.

Senior Engineering Microassembler

Career Center | Brooklyn, New York USA | Engineering,Production

Mini-Circuits designs, manufactures and distributes integrated circuits, modules, and sub-systems for high performance radio frequency (RF) and microwave applications.  With design, sales and manufacturing locations in over 30 countries, Mini-Ci

Mini-Circuits

Plasmatreat Opens Subsidiary in Switzerland

Industry News | 2021-01-17 17:46:07.0

Plasmatreat GmbH has further developed its international proximity to its customers in 2020 by founding the subsidiary Plasmatreat Schweiz AG to better serve the Swiss market. The company has been managed by Klaus Kresser (46) since August 1, 2020. Kresser is considered an expert in the adhesives industry and has cross-industry knowledge in international sales and project management as well as in development of adhesives and coatings.

Plasmatreat Group

Heraeus Electronics Introduces Optimized Copper Ribbon for Laser Bonding at PCIM Europe

Industry News | 2022-05-18 13:01:33.0

Heraeus Electronics today announced the launch of its new PowerCu Soft Laser Ribbons (LRB) for Laser Bonding during PCIM Europe in Nuremburg. This innovative optimized copper ribbon is proven to effectively achieve more efficiency and stability in power electronic systems. It enables module operation temperatures higher than 250°C and allows the highest power density designs.

Heraeus

Plasmatreat North America opens new sales and technical center

Industry News | 2012-11-11 14:07:47.0

Plasmatreat North America (PTNA) offices have moved to new premises, which are located in Ancaster, Ontario (CAN), about 45 miles west of Toronto/ Pearson International Airport and about 90 miles from Buffalo/Niagara Airport (USA).

Plasmatreat North America Inc.

Senior Engineer

Career Center | Brookfield, Wisconsin USA | Engineering

SR. ENGINEER � SENSORS -- $60-$80K Company: Well established controls manufacturer that has seen steady growth over the past several years. This company has a history of anticipating and successfully capitalizing on new market needs. Being one of t

Prime Resource Associates, Inc.

Anda to Debut TVS-400 Tabletop Precision Dispensing Machine at APEX 2023

Industry News | 2022-12-21 10:57:36.0

Anda Technologies today announced plans to exhibit at the 2023 IPC APEX EXPO, scheduled to take place Jan. 24-26, 2023 at the San Diego Convention Center in California. The company will highlight its total selective coating and fluid dispensing line solutions along with the AP-3 Series inline surface plasma treatment machine in Booth #1533. Additionally, the IPC APEX EXPO will be the first show appearance for their TVS-400 tabletop precision dispensing machine.

Anda Automation Pte Ltd

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications

Industry News | 2014-09-05 13:53:06.0

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.

AI Technology, Inc. (AIT)


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Selective soldering solutions with Jade soldering machine

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