Industry News | 2021-11-12 04:18:41.0
KYZEN will have an exciting new product introduction at SEMICON West. The show is back as a hybrid event from Dec. 7-9, 2021. The live, in-person event will take place at the Moscone Center in San Francisco, California. A virtual environment also will be available. KYZEN's MICRONOX® MX2120 Multi-Metal Safe Power Module Cleaner will be introduced at the event in Booth #1750.
Industry News | 2023-04-24 19:16:05.0
SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.
Industry News | 2024-05-20 10:37:16.0
KYZEN is excited to announce its participation in PCIM Europe 2024, scheduled to take place June 11-13, 2024 in Nuremberg, Germany. Visitors can find KYZEN at Hall 5, Stand 100, where the focus will be on advanced packaging solutions, specifically highlighting the MICRONOX® MX2123 Multi-Process Power Module Cleaner.
Industry News | 2014-11-07 10:35:14.0
AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.
Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
Industry News | 2015-11-12 21:24:58.0
KYZEN is pleased to announce that it will present at the LED A.R.T. Symposium, scheduled to take place Nov. 17-19, 2015 at the Crowne Plaza Midtown in Atlanta, GA. Dr. Mike Bixenman will present the paper titled “LED Failure Mechanisms That Can be Linked to Post Assembly Cleaning.”
Industry News | 2017-04-23 11:45:18.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), today announced that they will exhibit in Hall 4A, Stand 214, at the upcoming SMT/Hybrid/Packaging scheduled to take place May 16-18 at the Messe in Nuremberg, Germany.
Industry News | 2014-08-14 11:10:54.0
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Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
Industry News | 2012-09-05 13:53:47.0
Nordson DAGE announces that Keith Bryant, Global Sales Director X-ray Systems, will present “Recent Advances in X-ray Technology” at the upcoming Surface Mount & Light Emitting Diodes (SMALED) Conference
