Full Site - : wire bonding ultrasonic cleaning (Page 7 of 32)

Breakthrough Concept to Bond Circuit Board Jumper Wires

Industry News | 2008-11-12 20:09:45.0

November 10, 2008 - Haverhill, MA � CircuitMedic's Flextac Wire Dots replace glues and adhesives with super-sticky tape specially designed and cut to permanently secure circuit board jumper wires. This unique wire tacking product consisting of pre-cut shapes of a thin, flexible polymer film coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive. Flextac Wire Dots conform to the shape of the wire and the board surface providing a high strength bond to quickly and neatly secure jumper wires.

Circuit Technology Center, Inc.

New Dual-Head Wedge Bonder Makes Americas Debut

Industry News | 2013-06-07 14:37:14.0

Hesse Mechatronics will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.

Hesse Mechatronics

Palomar Introduces New Automatic

Industry News | 2003-05-05 09:13:55.0

Reliable Wire Bonders for High Yield Production

Palomar Technologies

Senior Engineer

Career Center | Brookfield, Wisconsin USA | Engineering

SR. ENGINEER � SENSORS -- $60-$80K Company: Well established controls manufacturer that has seen steady growth over the past several years. This company has a history of anticipating and successfully capitalizing on new market needs. Being one of t

Prime Resource Associates, Inc.

FlexTRAK Series Plasma Treatment Systems

FlexTRAK Series Plasma Treatment Systems

New Equipment | Surface Finish

FlexTRAK plasma treatment systems offer high-throughput, strip-type, and inline boat processing for advanced semiconductor packaging applications. The FlexTRAK/FlexTRAK-S, FlexTRAK-CD/FlexTRAK-CDS, FlexTRAK-2MB, and FlexTRAK-SHS systems suit various

MARCH Products | Nordson Electronics Solutions

Hesse Mechatronics Appoints Representative for South America

Industry News | 2014-01-24 16:21:17.0

Hesse Mechatronics has appointed HTMG as the company's sales representative for South America.

Hesse Mechatronics

CSP rework on mobile phone board

CSP rework on mobile phone board

Videos

Chip Scale Package Rework of a 3x3 mm µBGA component on a mobile phone board. The Fineplacer® core rework system handles all aspects of the rework cycle: http://eu.finetech.de/advanced-rework/products/fineplacer-core-rework-station.html

Finetech

FINEPLACER® core<sup>plus</sup> - Medium Size BGA Rework Station

FINEPLACER® coreplus - Medium Size BGA Rework Station

New Equipment | Rework & Repair Equipment

Cost Effective Rework of Medium Size Boards The FINEPLACER® coreplus is a compact, yet versatile rework system that offers a level of professionalism that exceeds its attractive price.  The system offers proven rework technology for a wide spectrum

Finetech

FINEPLACER pico rs - High Density SMT Rework Station

FINEPLACER pico rs - High Density SMT Rework Station

New Equipment | Rework & Repair Equipment

FINEPLACER® pico rs is an enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments. A high level of process modularity allo

Finetech

Labtech Microwave

Industry Directory | Manufacturer

Labtech is a UK based specialist high technology company offering Broadband Microwave Components and a range of related Microwave Manufacturing Services. Labtech is a subsidiary of Intelek plc www.intelek.plc.uk , a LSE listed company.


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