Industry News | 2005-12-15 11:50:05.0
Best Cleaning Material
Industry News | 2018-09-26 11:50:32.0
SHENMAO America, Inc. is pleased to introduce its SMF-UL51, which is a no-clean, halogen-free, ultra-low-residue spray flux. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
Industry News | 2014-05-07 16:11:10.0
AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.
Industry News | 2020-10-31 10:42:03.0
Indium Corporation's Jonas Sjoberg, Associate Director for Global Technical Service & Application Engineering, participated in a soldering-focused webinar hosted by MELSS on Thursday, October 15.
Industry News | 2016-06-22 16:15:35.0
KYZEN today announced plans to exhibit in Booth #305 at SEMICON West, scheduled to take place July 12-14, 2016 at the Moscone Center in San Francisco, CA. KYZEN will exhibit MICRONOX® MX2302 for wafer bumping, Ionox® FCR for wire bonding and MICRONOX® 2707 for Cu pillar flip chip applications.
Industry News | 2021-11-12 04:18:41.0
KYZEN will have an exciting new product introduction at SEMICON West. The show is back as a hybrid event from Dec. 7-9, 2021. The live, in-person event will take place at the Moscone Center in San Francisco, California. A virtual environment also will be available. KYZEN's MICRONOX® MX2120 Multi-Metal Safe Power Module Cleaner will be introduced at the event in Booth #1750.
Industry News | 2023-04-24 19:16:05.0
SHENMAO America, Inc. is proud to announce the release of its new product, the UV Visible Lead-Free No-Clean Solder Paste PF629-P214UV. This innovative new solder paste is designed to meet the demands of modern electronics manufacturing, offering excellent performance and reliability.
Industry News | 2013-01-16 13:59:39.0
Seika Machinery, Inc., will showcase its proven, advanced machinery in booth #2727 at the upcoming IPC APEX EXPO
Industry News | 2014-11-07 10:35:14.0
AI Technology is proud to announce that it will be attending two conferences this November. The first conference AIT will be attending is the International Wafer-Level Packaging Conference (IWLPC), November 11-12 at the Double Tree Hotel in San Jose, CA. This year, AIT's own Dr. Frederick Lo will be presenting his paper, Recent Advances in Die Attach Film.
Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
