Electronics Forum | Thu Nov 03 02:34:46 EST 2005 | Rosewood
We've recently encountered some problems with wire bond strengths. I'm looking for anybody that has had some experience with different types of substrate contamination and methods for cleaning. There is no visible contamination on the gold pads, bu
Electronics Forum | Thu Nov 03 21:40:40 EST 2005 | davef
There maybe multiple drivers to your problems. * First, decreasing bond quality with time indicates a plating issue. What's the actual thickness of your gold and nickel on the pads? * Second, the no-sticks indicate contamination. If it's organic, p
Electronics Forum | Thu May 18 03:15:32 EDT 2017 | wama
We are soldering wire 26AWG to jack socket. However after went through washing, baking, coating, curing processes the wire breaks (at joining point with jack socket) during wire dressing. We have tried to increase and decrease the solder amount but r
Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris
The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi
Electronics Forum | Thu Dec 29 03:57:16 EST 2005 | sparrow
Hello Chris, To be honest, it's hard to believe you could not bond to ENIG at all. Yes, the gold layer is thin and hard, but it just narrows the process window and does not make the bonding impossible. I say this, because we have been using TS gold w
Electronics Forum | Tue May 13 21:08:24 EDT 2003 | ramanandkini
Dear Sir, Sorry for the delay in reply. This is regarding MIL standard for bond pull strength: MIL-STD-883C dt.25/08/83 Bond strength (destructive bond pull test); refer table-1 Minimum bond strengths for various wire composition & diameter given.
Electronics Forum | Mon Mar 17 10:36:04 EST 2003 | davef
Ramanandkini 14 gm versus 5 gm: 14 gm [even 10 gm] sounds better than 5 gm. We get good bond pull XBAR (high teens) and low sigma (
Electronics Forum | Tue Nov 15 12:21:20 EST 2005 | arclightzero
Well, I can't speak for them falling off later on, as that's not when I see them, and they are passing their wire pull tests after bonding. What I am seeing is electrical opens during testing, and these opens coincide with the Au/Al bonded points. Th
Electronics Forum | Mon Sep 09 15:38:02 EDT 2013 | arendonk
Hi, We are having issues aluminum wirebonding on ENEPIG plated PCB by a too low pull force and or having lifts (1% range). Could any body advice how to solve this problem? Is there a special wire bond grade required? How to best clean contaminant
Electronics Forum | Mon Aug 27 15:06:29 EDT 2001 | davef
This otta push Wolfgang over the top ... Recommended reading G.G. Harman, Wire Bonding in Microelectronics : Materials, Processes, Reliability, and Yield, 2nd edition, McGraw-Hill Electronic Packaging and Interconnection Series, 1997. G.G. Harman, R
