Electronics Forum | Wed Jul 11 14:44:33 EDT 2007 | cyber_wolf
Ya I found that out while pulling the motor wires out of the terminal blocks.
Electronics Forum | Mon Nov 13 20:55:11 EST 2000 | Dave F
Not too much to go on, bud. Tell us about: * Wire material, finish, insultation, etc * Wetting problem description * Why feed that the wire is used for through is important * Range and extent of the problem * Results of metallographic analysis of "g
Electronics Forum | Mon Apr 11 08:27:10 EDT 2011 | leemeyer
I have had similar problems before where the machine will intermittently stop with a limit error. Reset the machine and away it goes. Replacing the ribbon cable that runs from the head (37 pin D-sub)has solved this problem. This cable gets flexed a l
Electronics Forum | Tue Aug 02 15:03:37 EDT 2016 | davef
On a previous black pad experience we soldered a wire to a fiducial and did a pull test to failure. On the black pad board the wire and solder pulled of clean leaving the fiducial on the board. On good boards the copper came off with the wire. If you
Electronics Forum | Fri Oct 22 10:41:08 EDT 2010 | janz
hi 1) just run test batch and pull test wire. Use MIL std to find out your results. 2) again run through and test wire.
Electronics Forum | Wed Mar 06 15:49:50 EST 2019 | rhoderik
Hello, I have an MPM Accuflex at work that has suffered an accident. Some wires have benn pulled off a connector and now we don't have a clue about how it was connected. Can someone send the pdf manual to me? My e-mail is rhoderik@hotmail.com Thanks!
Electronics Forum | Sun Oct 07 07:34:25 EDT 2001 | davef
No one wants to be limited to one alternative in evaluating such equipment. Who would you suggest as viable alternatives to: * Cyber Optics in evaluating alternate suppliers for inspection equipment? * Royce Instruments in evaluating alternate sup
Electronics Forum | Wed May 18 07:22:06 EDT 2005 | davef
Wire bonds don't stick when bonded * Check pull and shear strength. * Depending on point of failure, review parameters. * Listen during bonding, if there is a high pitch buzz, there is vibration in the system somewhere, "seek and destroy". * Get the
Electronics Forum | Tue Apr 11 16:42:56 EDT 2000 | Chad Notebaert
I�m thinking �Poor intermatallic� It could be a few things. Lets start at the beginning. -Is your paste a 63/37 mixture? -Have you monitored you screen printing, Verify Solder deposition, Are you getting enough paste? -You say the solder looks like i
Electronics Forum | Thu Jan 14 08:52:49 EST 2016 | proceng1
I've used a data logger that I borrowed to do some testing. It was ok, but I found it cumbersome to blindly wait and then have to download the run each time, vs being able to watch it live. Also, we had a few instances when the unit timed out or di
