Used SMT Equipment | Chipshooters / Chip Mounters
(3) Fuji CP743E Chipshooters; 2003 - 2004 vintage. All consigned into the High Technology Exchange on March 12-14 on www.xlineassets.com List of additional equipment includes: TEST AND MEASUREMENT: Advantest Spectrum Analyzers Rhode and Schwa
New Equipment | Cable & Wire Harness Equipment
Overview The PullTester 325 is a triple-range, motorized benchtop device for measuring pull forces of crimp connections, welded connections or many other possibilities. The triple-range capability gives the PullTester 325 incredible application flex
New Equipment | Cable & Wire Harness Equipment
Overview Schleuniger's PullTester 27 is a dual-range, motorized benchtop device designed to measure pull forces of wire crimp connections as well as ultrasonic metal welding connections on a wider range of wire than single-range pull test devices.
Used SMT Equipment | THT Equipment
GORMAN HUSTLER TOROID PULL WINDER,COMPLETE WITH CHOICE OF SMALL OR LARGE CORE SUPPORT ARMS,CORE ROTATION REVERSING LEVER, REVERSING LEVER,2 SETS CORE ROTATORS,2 MAGNET WIRE HOOKS,2 STEEL RODS FOR ATTACHING HOOKS,2 BENCH CLAMPS,AND GORMAN EXCLUSIVE AU
New Equipment | Cable & Wire Harness Equipment
Overview The PullTester 25 is a dual-range, motorized benchtop device for measuring pull forces of crimp connections as well as ultrasonic metal welding connections on a broader range of wires than single-range pull test devices. Speed control
New Equipment | Test Equipment - Bond Testers
Nordson DAGE is the leading provider of award winning bond testing equipment. The second generation 4000Plus bondtester continues to be the most advanced bondtester on the market whilst the 4000 Optima is optimized for fast, accurate and reliable bon
New Equipment | Cable & Wire Harness Equipment
Overview The PullTester 326 is a triple-range, motorized benchtop device for measuring pull forces of crimp connections as well as welded connections. The triple-range capability gives the PullTester 326 incredible application flexibility to handle
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
New Equipment | Cable & Wire Harness Equipment
Overview The PreFeeder 2200 is a free-standing, electrical prefeeding machine designed to pull wire and cable from reels weighing up to 50 kg (110 lbs.). Application Range The PreFeeder 2200 is a free-standing, electric-demand prefeeding machin
New Equipment | Cable & Wire Harness Equipment
The PreFeeder 4200 is a free-standing capstan drive prefeeder designed to pull wire and cable up to 25 mm (1.0“) in diameter from reels weighing up to 182 kg (400 lbs.). Application Range The PreFeeder 4200 is a free-standing capstan drive prefeede