New Equipment | Cable & Wire Harness Equipment
Overview The UniStrip 2300 programmable stripping machine strips wires ranging in size from 0.03 – 6 mm² (32 – 10 AWG) and jacketed cables up to 5.5 mm (0.22“) in diameter. This innovative machine does not require any mechanical adjustments to proce
Industry News | 2013-10-31 11:53:09.0
Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.
New Equipment | Cable & Wire Harness Equipment
The RotaryStrip 2400 is an impressive, fully programmable stripping machine with high precision and flexibility. Wire sizes from 0.013 - 6 mm² (36 - 10 AWG) can be processed without any mechanical adjustments. The RotaryStrip 2400 can strip wires wit
Vice President of Product Management, Pete Doyon providing a demonstration of Schleunigers UniStrip 2300 and the PowerStrip 9550 MR at WPE
The RotaryStrip 2400 is the next generation single conductor bench top wire stripping machine, which easily strips Teflon, Kapton and Fiberglass insulated wires with optional twisting of the inner strands. This fully programmable machine, featuring a
Industry Directory | Consultant / Service Provider / Manufacturer
Shan Dong Finer Lifting Tools co.,LTD here! We are the manufacturer of follow lifting tools: spring balancer, roller skids, hydraulic toe jack, fluid caster, permanent magnetic lifter and so on material handling tools.
Industry News | 2013-05-06 18:13:00.0
Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.
Industry News | 2009-04-21 14:12:30.0
Carpenter Manufacturing will have the complete Carpenter product line on display and operating in booth 1413 at the upcoming Electrical Wire Processing Technology Expo, scheduled to take place May 20-21, 2009 at the Midwest Airlines Center in Milwaukee, WI.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
Technical Library | 2024-04-08 15:46:36.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
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