Technical Library | 2015-02-19 16:54:34.0
Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method with solder ball attached and positioning the test board at an angle of 30º is employed to study the strength of pad cratering. This new method clearly reveals the failure mechanism. And a proper way to interpret the finite element analysis (FEA) result is discussed. Impact of pad dimension, width and angle of copper trace on the strength is included. Some findings not included in previous research could help to guide the design for better performance
Technical Library | 2019-05-08 21:52:28.0
Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df
Industry News | 2019-11-05 22:21:39.0
Very often, customers ask details about what kind of testing do we use? How do we charge it? Do I have to pay every time or only for the first time? Is this testing safer and better than other one? etc In this blog, let's discuss the various kind of testing and their advantages and disadvantages. Some of them are mandatory, some of them are optional; Some of them are fast, some are slow; some of them are more reliable, and some not. Hope you will have a better understanding about various kinds testing and make better decision on your next PCB order.
Industry News | 2012-04-18 10:57:12.0
Badger Technologies has incorporated Aegis' MOS Manufacturing Operations Software into their Farmington, NY factory. The Aegis MOS is helping Badger to better fulfill their customer’s needs by streamlining their NPI documentation and machine programming processes, and allowing improved, online access to the documentation.
Industry News | 2022-09-26 07:02:19.0
Datest is pleased to announce that it received a 2022 Mexico Technology Award in the category of Test Services for its Enhanced High Density Precision Geometry Flying Probe Wafer Testing Services. The award was announced during a ceremony that took place Wednesday, Sept. 21, 2022 during SMTA Guadalajara in Mexico.
Industry News | 2017-10-17 19:47:15.0
Nordson DAGE, Nordson MATRIX, and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit in Hall A2 Booth 445 at productronica 2017, scheduled to take place Nov. 14-17, 2017 at the Messe München in Germany.
Industry News | 2009-12-02 21:17:33.0
Altium releases smart prototyping peripheral board for its NanoBoard FPGA-based development platforms.
Industry News | 2011-11-20 13:14:27.0
Nordson DAGE has been awarded a Global Technology Award in the category of Test Equipment for its 4000Plus Bondtester Pad Cratering Inspection System.
Industry News | 2013-05-06 18:13:00.0
Hesse Mechatronics will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder at the company’s west coast demonstration and applications lab, located at long-time company manufacturer's representative Chalman Technologies in Anaheim, California.
Industry News | 2013-03-20 10:54:36.0
Nordson DAGE, announces it will exhibit in Booth # 7-224 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.