The CoaxStrip 5500 is a semi-automatic, programmable stripper designed to perform both single and multiple stage strips. Its processing capabilities make the CoaxStrip 5500 a perfect match for a wide range of wires and cables such as coaxial and mult
The CoaxStrip 5300 is a semi-automatic, programmable multi-step stripper for coaxial, triaxial, multi-conductor cable and single conductor wire. This benchtop unit can easily process coaxial and triaxial cables up to 0.276'' (7 mm) outer diameter and
New Equipment | Cable & Wire Harness Equipment
The highly dynamic PreFeeder 60 prefeeding machine has been specially designed for use with fully automatic crimping machines such as the Schleuniger CrimpCenter models. It feeds wire and cable up to 6 mm² (10 AWG). Processing Capabilities Prefee
Technical Library | 2020-08-27 01:22:45.0
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. The nodules and scratches were not defined by measurable dimensions and were considered to be unacceptable if there was any sign of a visual blemish on wire-bondable features. Analysis of the yield at a PCB manufacturer monitored monthly for over two years indicated that the target yield could not be achieved, and the main reasons for yield loss were due to nodules and scratches on the wirebonding pads. The PCB manufacturer attempted to eliminate nodules and scratches. First, a light-scrubbing step was added after electroless copper plating to remove any co-deposited fine particles that acted as a seed for nodules at the time of copper plating. Then, the electrolytic copper plating tank was emptied, fully cleaned, and filtered to eliminate the possibility of co-deposited particles in the electroplating process. Both actions greatly reduced the density of the nodules but did not fully eliminate them. Even though there was only one nodule on any wire-bonding pad, the board was still considered a reject. To reduce scratches on wirebonding pads, the PCB manufacturer utilized foam trays after routing the boards so that they did not make direct contact with other boards. This action significantly reduced the scratches on wire-bonding pads, even though some isolated scratches still appeared from time to time, which caused the boards to be rejected. Even with these significant improvements, the target yield remained unachievable. Another approach was then taken to consider if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful. A gold ball bonding process called either stand-off-stitch bonding (SSB) or ball-stitch-on-ball bonding (BSOB) was used to determine the effects of nodules and scratches on wire bonds. The dimension of nodules, including height, and the size of scratches, including width, were measured before wire bonding. Wire bonding was then performed directly on various sizes of nodules and scratches on the bonding pad, and the evaluation of wire bonds was conducted using wire pull tests before and after reliability testing. Based on the results of the wire-bonding evaluation, the internal specification for nodules and scratches for wirebondable PCBs was modified to allow nodules and scratches with a certain height and a width limitation compared to initially adopted internal specifications of no nodules and no scratches. Such an approach resulted in improved yield at the PCB manufacturer.
Technical Library | 2023-08-04 15:27:30.0
A designed experiment evaluated the influence of several variables on appearance and strength of Pb-free solder joints. Components, with leads finished with nickel-palladium-gold (NiPdAu), were used from Texas Instruments (TI) and two other integrated circuit suppliers. Pb-free solder paste used was tin-silver-copper (SnAgCu) alloy. Variables were printed wiring board (PWB) pad size/stencil aperture (the pad finish was consistent; electrolysis Ni/immersion Au), reflow atmosphere, reflow temperature, Pd thickness in the NiPdAu finish, and thermal aging. Height of solder wetting to component lead sides was measured for both ceramic plate and PWB soldering. A third response was solder joint strength; a "lead pull" test determined the maximum force needed to pull the component lead from the PWB. This paper presents a statistical analysis of the designed experiment. Reflow atmosphere and pad size/stencil aperture have the greatest contribution to the height of lead side wetting. Reflow temperature, palladium thickness, and preconditioning had very little impact on side-wetting height. For lead pull, variance in the data was relatively small and the factors tested had little impact.
New Equipment | Cable & Wire Harness Equipment
The PreFeeder 4200 is a free-standing capstan drive prefeeder designed to pull wire and cable up to 25 mm (1.0“) in diameter from reels weighing up to 182 kg (400 lbs.). Application Range The PreFeeder 4200 is a free-standing capstan drive prefeede
The UniStrip 2550 is a fully programmable stripping machine, offering high precision and flexibility. It strips wires ranging in size from 0.03 - 6 mm² (32 - 10 AWG) and jacketed cables up to 5.5mm (0.22") in diameter. The machine comes standard with
Industry News | 2015-06-29 16:17:14.0
Saline Lectronics recently purchased and installed a Seica Pilot 4D V8 Flying Probe Tester. This new system further enhances Saline Lectronics’ testing capabilities and will allow the company to better support each of its clients’ unique testing requirements.
The CoaxStrip 5300 RX allows you to quickly and accurately strip wires and cables that would be virtually impossible to strip by hand, with inner conductors ranging from 0.003'' / 0.07 mm (42 AWG) up to 0.080'' / 2 mm maximum cable outer diameter (O.
Training Courses | | | IPC/WHMA-A-620 Trainer (CIT)
The Certified IPC/WHMA-A-620 Trainer (CIT) courses recognize individuals as qualified trainers in the area of cable and wire harness fabrication and installation, and prepares them to deliver Certified IPC/WHMA-A-620 Specialist (CIS) training.
