Electronics Forum | Mon Jan 30 19:27:50 EST 2017 | jgo
Hi all, I'm wondering how does one decide to use flux dipping or solder printing when it comes to be attaching CSPs onto the board? Solder printing has an advantage in that there will be a higher throughput on the mounter as there is no flux dippin
Electronics Forum | Mon Dec 16 15:00:56 EST 2002 | sueph
We have always baked our assembled boards prior to wave solder, but have recently learned that there are some companies out there who don't. I checked with one of my supervisors, and he said that baking is recommended but not required. I'm wonderin
Electronics Forum | Fri Apr 06 16:19:12 EDT 2001 | davef
We build a mixed tech [eg, QFP, SMT fly shit, DIP] board where we can't clinch the DIP. So we set the clinch and cut on the DIP to just barely clinch, leaving the leads very perpendicular to the board. I wonder if you could do something similar wit
Electronics Forum | Thu Mar 19 03:15:45 EST 1998 | Leonard Wesson
We are a small company that specializes in upgrading portable computers. We are now wanting to venture into Pentium upgrades which requires removal & resoldering of TCP - Tape Carrier Package CPUs. How is this done? We currently rework SMT without
Electronics Forum | Thu Feb 16 09:00:35 EST 2006 | russ
Samir, You are a nut! I wouldn't cut your hands off! I asked because I was wondering about the stability and repeatability of the wave machine itself being used as the standard. I do understand Gage R&R or at least I think I do that was why I aske
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Wed Jan 23 14:09:10 EST 2008 | lmartenson
We have carriers that we use in wave flow solderers that are machined specifically for each board out of ESD composite. I was wondering if anyone knows about lead contamination of this material and the cleaning of composite? I know that it is a p
Electronics Forum | Wed Aug 11 13:44:40 EDT 1999 | Paul Wareham
We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or o
Electronics Forum | Fri Aug 13 07:18:19 EDT 1999 | Brian Conner
| We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave or
Electronics Forum | Fri Aug 13 07:26:06 EDT 1999 | Brian Conner
| | We are using a mixed technology process with mostly through-hole parts plus some SMT IC's on the component side and some passive SMT parts on the solder side. We do not have a proper wave soldering machine for doing solder side SMT (double wave
.png)
