Electronics Forum | Tue Feb 03 14:19:29 EST 2009 | grics
I would agree if you have a board to setup the process. But sometimes this doesn't work... If for some reason if the customers AVL has a Lead Free BGA and I am running Leaded paste (yes this really happens!), you will need to run hotter to get your
Electronics Forum | Thu Jun 20 14:39:35 EDT 2002 | russ
I use TechSpray Wsol 2204-8SQ. This is a water soluble mask that is very thick and works pretty well for this application. Drying time depends on thickness and you should let it dry at least for a little while prior to running through the wave. Ea
Industry News | 2003-04-30 08:51:08.0
Electrolube played the role of environmental champion in Australia recently.
Industry News | 2018-10-18 10:13:08.0
The Application of the Pin-in-Paste Reflow Process
Technical Library | 2016-01-21 16:52:27.0
Solder paste has long been viewed as "black magic". This "black magic" can easily be dispelled through a solder paste evaluation. Unfortunately, solder paste evaluation can be a challenge for electronic assemblers. Interrupting the production schedule to perform an evaluation is usually the first hurdle. Choosing the solder paste properties to test is simple, but testing for these properties can be difficult. Special equipment or materials may be required depending upon the tests that are chosen. Once the testing is complete, how does one make the decision to choose a solder paste? Is the decision based on gut feel or hard data?This paper presents a process for evaluating solder pastes using a variety of methods. These methods are quick to run and are challenging, revealing the strengths and weaknesses of solder pastes. Methods detailed in this paper include: print volume, stencil life, response to pause, open time, tack force over time, wetting, solder balling, graping, voiding, accelerated aging, and others.
Technical Library | 2016-11-30 21:30:50.0
Mid-chip solder balling is a defect typically associated with solder paste exhibiting poor hot slump and/or insufficient wetting during the reflow soldering process, resulting in paste flowing under the component or onto the solder resist. Once molten, this solder is compressed and forced to the side of the component, causing mid-chip solder balling.This paper documents the experimental work performed to further understand the impact on mid-chip solder balling from both the manufacturing process and the flux chemistry.
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board
LED panel is a kind of flat panel display which is composed of small LED modules. It is the largest and most widely used large-screen panel technology at present. It can be used not only indoors but also outdoors, waterproof, windproof and rain proo
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SMT Express, Volume 4, Issue No. 7 - from SMTnet.com Volume 4, Issue No. 7 Monday, July 22, 2002 Featured Articles The Essentials of Outsourcing by Peter C. Gordon - DNE Manufacturing & Service Company From time to time
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. SMT PRODUCTION LINE CONTACT US You are here: Home » News & Events » News » Introduction to the working principle of Lyra Reflow Oven Introduction to the working principle of Lyra Reflow Oven Views: 0 Author: Site Editor Publish Time: 2022-05-28 Origin
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. The benefits of the pin-in-paste reflow process include: Use of the same SMT equipment for both SMT and TH components Elimination of hand and wave soldering processes Reduction of machine setup time Reduction of production turn around space and time
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