Full Site - : wrong orientation (Page 5 of 8)

Walkmen In Assembly Area

Electronics Forum | Fri Dec 13 10:21:28 EST 2002 | gregp

You asked for opinions, here's mine. If you feel you need to wear a walkman to get thru the day then you can go wear it in the unemployment line. Anyone who says they are more productive when wearing a walkman and listening to music in a dynamic wor

Component location related to Fiducial marks

Electronics Forum | Wed Sep 08 20:48:28 EDT 2004 | Darby

Yes I agree with Russ about someone asking up front and everything else. Two tips. 1. Keep the marks at least 5mm in from the conveyor edges of the pcb so that clamping systems do not hide the mark. 2. Make sure the marks are eccentric around the pcb

CP642 Ballscrew Replacement

Electronics Forum | Wed Jun 24 08:19:59 EDT 2009 | fujiphil

Hi, Procedure how to replace the x-ballscrew of CP642. 1. Before you remove the x-motor, remember the pulse of x-axis motor just it turn ON the zero set sensor. Pulse usually at 1000pls. +/-50pls. 2. Turn Off the machine. 3. Compress the two ballsc

TECHNICIAN

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HANDLING OF MAINTENANCE Camelot,Mascot, Selective Soldering,Wave Soldering,Aquastorm 200,H-500 HI-Z,Kolb,kerry&PBT,GETECH, ATI 105 & Final Touch 101,Heller,Btu&vapour phase,Shuttle,SRT,ESD ,Electrical maintenance . Knowledge in using SLIM KIC 2000&

Re: Closer lead more soldering bridge by using spray flux

Electronics Forum | Tue Jun 08 17:52:53 EDT 1999 | Chrys Shea

| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s

First Article Inspection

Electronics Forum | Wed May 15 22:23:38 EDT 2002 | ianchan

Hi mates, need some help to resolve a thumb-twine situation. As a high-mix, low volume prototype build house, we always conduct a first article inspection (FAI) on every model setup conversion in the SMT production Lot run. we do this FAI by mounti

Re: Oven Reflow vs Wave Solder

Electronics Forum | Fri Apr 23 12:10:41 EDT 1999 | Dave F

| A customer told me that pad geometry was to be different depending on soldering process. | | I think this is untrue. What is stated in the IPC - SM -782 standards is that parts should be placed to elimanate a trailing edge. This however should

Re: Misalignment Issue (CAD Vs. Machine Variables

Electronics Forum | Sun Nov 12 17:35:40 EST 2000 | Darby

George, You need to calibrate your chucking assemblies! . What you are seeing is poor alignment due to egocentricity in you jawing assemblies. Also make sure that your jaws/nozzles are in good condition and that your assemblies are correctly orientat

Re: Barcoding Component Reels

Electronics Forum | Thu Aug 17 07:53:31 EDT 2000 | Wolfgang Busko

Getting things "foolproof" is sometimes a hard effort and can cost a lot of money. Who is able to tell that it actually saves money instead of wasting it. Transfering responsibility from operators to a system may lead to a somewhat less responsible a

Re: DFM / DFT information - Darn unmasked!

Electronics Forum | Fri Jul 14 16:29:12 EDT 2000 | Dave F

Awww John, if I typed all that folderol, my spell checker would have gone kaaablewee!!! Most of the stuff I listed is tactical, because I assume most people on the forum are DFM / DFT choir and by the time we get involved, some BIG $$$ consultant ha


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