Electronics Forum | Mon Jan 21 16:13:50 EST 2008 | arun2382
We see delamination at Mold compound to substrate interface when tested for MSL3. We haven't tested the substrate for cleanliness. Can you please suggest methods for this? thanks, arun
Electronics Forum | Mon Feb 04 07:43:02 EST 2008 | davef
Bruce: We know Arun is not cleaning the board properly. Arun does not know how to determine if the board is clean. Arun doesn't know how long to clean the board. Apparently, you do. Tell Arun the answers.
Electronics Forum | Tue Jul 23 15:41:31 EDT 2002 | habs24
Does anyone have any information or experience soldering of class 3 products with WS fluxes. We are currently leaning toward Alpha WS609 flux, however the customer's interpretation of J-Std-001C feels that type 'H' fluxes (WS) are not allowed. Any
Electronics Forum | Tue Jan 29 13:51:24 EST 2008 | bbarton
Dave F....BOGUS BOGUS BOGUS What compatability issue could there possibly be if the flux is removed during wash???? Why on EARTH would you leave ANY WS flux residue on the board? A recipie for disaster! Beef up the cleaning process, test for contami
Electronics Forum | Mon Jun 06 12:51:17 EDT 2016 | wlsmt
My operator applied flux gel ALPHA WS-609 on MG P/N FTH101XAP (CAP ALUM 100UF 50V 20% SMD) before aqueous washing the PCBAs. Solder paste used was ALPHA WS-820. Now the caps have yellow stains. Any solution to this is appreciated. Tks
Electronics Forum | Thu Jun 25 20:26:37 EDT 1998 | Chiakl
| I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi
Electronics Forum | Tue Jun 30 11:51:41 EDT 1998 | Michael Fogel
| | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everyt
Electronics Forum | Thu Jul 02 19:18:31 EDT 1998 | Rin
| | | | I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. E
Electronics Forum | Thu Jun 25 20:16:01 EDT 1998 | chiakl
| I am looking for a little enlightenment with an issue that we have been seeing. We have SMT assemblies with poor solderability on TSOP and mini-QFP type devices. The solder appears to have incomplete reflow and/or grainyness to the joints. Everythi
Electronics Forum | Wed Apr 09 13:30:20 EDT 2003 | davef
In order to get reliable reflow, you need to be at or higher than [liquidus + 20*C] for about 5 to 10 seconds. [I said 25* in a earlier post, but in an effort to stay on message, I'll stick with 20*] Don't forget that your liquidous is probably NOT
