Electronics Forum | Fri Feb 11 05:44:08 EST 2000 | Dean
Sounds like black pad to me. I just suffered this last week. Track your fab lot codes. Just in case. I processed 1000 fabs of 2 lot codes through 1 line (also WS609). 1 lot code failed with black pad the other did not. With one common mfg. proc
Electronics Forum | Thu Dec 07 11:38:04 EST 2000 | Dason C
Please advsie what kind of the solder paste which you are using and we have experience when using Alpha WS609 and found a lot of foaming. Beside, are you using the spray fluxer for your wave or not? If you have spray fluxer then you don't need to u
Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Mon Sep 20 14:53:24 EDT 1999 | Doug
I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are using Alpha
Electronics Forum | Wed Apr 09 10:17:28 EDT 2003 | ksfacinelli
http://picturecenter.kodak.com/share?invite=ZExr4tzrmmYeI5Uozhlo Here is a link to the pictures. This is a HASL board with ws-609 paste. Lead parts look good but would like to see a shinner joint in the BGA area. Thermal profile looks good 150-15
Electronics Forum | Fri Jan 18 18:19:38 EST 2008 | arun2382
Is normal DI rinse cycle enough to wash away all residue after SMT assembly of high density substrate? This substrate would later be over molded to form MCM module package and I am seeing delamination in high density areas of the substrate at MSL3
Electronics Forum | Sun Feb 03 16:50:59 EST 2008 | bbarton
Won't argure with you Davef, but guys who suggest totally unnecessary steps to resolve a cleaning problem drive me NUTS!! What would the moulding compound manufacturer have to do with it? HIS BOARD IS NOT CLEAN!! Keep it simple, get the job done! Don
Electronics Forum | Fri Feb 29 07:32:43 EST 2008 | samitokgoz
We have the same problem... We are using water soluable solder paste (Alpha ws609) and it dries out very quick. I don't want to throw out the paste inside the printer, but on the other and I don't want to risk my production by adding flux or alchol o
Electronics Forum | Fri Feb 29 08:14:33 EST 2008 | cyber_wolf
Thats funny that you mention the WS609. That is the exact same paste we used back in the early 90's. That formulation is notorious for drying out and getting chunky. That is a very dated flux chemistry. I would advise looking into some of the twenty
