Electronics Forum | Tue Dec 10 19:30:49 EST 2002 | Vijay
Hi Dave, The peak temp on the leads is 216-218 Deg C and duration above MP (179 degC) is 55-60 sec. Alloy(solder paste) used 62 Sn,36 Pb 2Ag (Alpha WS 609 Ty 3 Water eash) This is a SMT connector wth Gulwing leads Gold plating on the PCB is 2-5 micr
Electronics Forum | Tue Dec 10 20:42:43 EST 2002 | davef
Vijay, Sounds like you're not spending enough time at liquidous plus 20*C. And you need to stay there for 5 to 10 seconds. I know, I know. We have used bucketsful of WS609 over the years. See, as you say, the melting point of your solder alloy
Electronics Forum | Wed Apr 09 23:37:52 EDT 2003 | MA/NY DDave
Hi I know what DaveF is saying about the Kapton situation, yet from what I remember also at a KIC presentation the Kapton technique wasn't given as bad a billing as Dave describes. You do have to make sure you get a good firm contact and verify it
Electronics Forum | Thu Jun 17 07:04:03 EDT 2004 | davef
It sounds like the parts are not soldering properly [have poor solderability]. This probably due to corroded nickel underplate caused by: * Nickel that oxidized, while awaiting overplating * Poor quality tin overplate, allowing nickel to oxidize aft
Electronics Forum | Mon Apr 29 10:42:47 EDT 2002 | Jim M.
I had problems with white residues on both WS609 and WS 3060.The WS 3060 turned out to be a carbonized material.The composition after analysis (Energy Dispersive X-ray spectrum) turned out to be tin,tin,phosphore and cloline and tin. Alpha also have
Electronics Forum | Wed Jan 13 07:37:45 EST 1999 | EFData
We have evaluated using WS-629 and our feelings are that the formula is not very stable. One evaluation showed great results; superior solder joint appearance and good printability. The paste would not roll on another evaluation nor would it release
Electronics Forum | Mon Apr 07 09:52:07 EDT 2003 | kmorris
I have just started an assembly which uses a 16 mil pitch QFP. We ran on Saturday, using a type 3 solder paste. (working Sat's really sucks) We really struggled with paste release after the stencil sat for 15 minutes without printing. Apertures clog
Electronics Forum | Wed Jul 24 22:45:54 EDT 2002 | davef
WS609 is a wonderful paste. J-STD-001, 4.2 states words to the effect that for Class 3 products Type H or M fluxes should only be used for tinning operatins. Most water soluable fluxes are either H or M. I believe that you can use Type H or M flux
Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa
Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor
Electronics Forum | Mon Sep 20 17:26:22 EDT 1999 | Earl Moon
| I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. | The stencil is 6 mil thick, laser cut and electo-polished. | The apertures are 12 mil in diameter with 20 mil pitch. | We are usi
