New Equipment | Solder Materials
NC Paste Flux is a no clean tacky/rework flux designed to wet virtually all solderable electronic surfaces, components, assemblies, and substrates. AIM NC Paste Flux may be used for general touch up or rework of printed circuit boards, and for attach
Industry Directory | Manufacturer
SHENMAO Technology, Inc. supplier of Pb/Pb-free Solder Pastes, Solder Wire, Solder Bar, Flux, BGA Sphere, Bumping Paste/Flux, PCB Plating Anode, PV Ribbon Electronics Assembly Materials, for over 44 years from 10 world locations.
New Equipment | Solder Materials
For BGA's and PCB Production and Rework Sphere Accurate to +/- .001, All standard sizes available Standard Sizes of Sphere's: .035" +/- .002 10SN/90PB High-Temp .030" +/- .001 63SN/37PB .022" +/- .001 63SN/37PB .016" +/- .001 63S
Flux in-line Solder Flux Inspection and Measurement System process control tool for BGA, CSP and flip chip component manufacturing
New Equipment | Cleaning Agents
MAIL IN & FREIGHT IN AVAILABLE - We can assist with logistics Outsourced Services Flux removal PCB Cleaning manually with chemistries In-House Testing & Diagnostics PCB Repair SMT Electronics Reflow / Rework BGA Rework / Replacement BGA
New Equipment | Solder Materials
Kester Tacky Solder Fluxes (TSFs) are the industrial standard for Flip Chip and BGA Sphere Attach. With viscosities optimized for high speed application and holding of a chip or sphere in place prior to reflow, Kester TSF’s enable wide process window
Industry Directory | Distributor
SMT Sales Associates is a Distributor of Soldering Materials and Manufacturers Rep agency in the PCB Assembly World. At out store www.solderandmore.com we sell soldering materials such as Solder Paste, Wire Solder, Flux, BGA Spheres, and Bar Solder.
Industry Directory | Distributor
We r Authorized Distributors for Alpha Assembly (Cookson India P Ltd) 4 Maharashtra, Gujarat Regions. Products- Solder Paste/Glue/Stick/Flux/Cleaning/Adhesive/Glue/BGA/Soldering Paste/Dross Reducer
Technical Library | 2017-08-17 12:23:27.0
A novel epoxy flux EF-A was developed with good compatibility with no-clean solder pastes, and imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achieved by a well-engineered miscibility between epoxy and no-clean solder paste flux systems, and is further assured with the introduction of a venting channel. The compatibility enables a single bonding step for BGAs or CSPs, which exhibit high thermal warpage, to form a high-reliability assembly. Requirements in drop test, thermal cycling test (TCT), and SIR are all met by this epoxy flux, EF-A. The high viscosity stability at ambient temperature is another critical element in building a robust and userfriendly epoxy flux system. EF-A can be deposited with dipping, dispensing, and jetting. Its 75°C Tg facilitates good reworkability and minimizes the adverse impact of unfilled underfill material on TCT of BGA assemblies.
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