Electronics Forum | Thu Sep 02 07:22:03 EDT 1999 | Earl Moon
| I'd like to know the advantages and disadvantages between the two. | | Thanks and regards, | | Both have their place. When using less fine pitch (.025" +) with fine pitch (.020" or less and BGA's) a .007" thick stencil may be used. This would re
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Concentrated fine copper braiding utilizes less length of wick for each desoldering... MSRP: Now: $83.08 Add to Cart Compare Quick view EasyBraid | sku: S-E-10AS DESOLDERING BRAID, SEA BRAID, .125" X 10', ANTISTATIC, 25/PACK Used in the rework and repair of
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: 13.5″ x 22″ Smallest Component Capacity: 0201 Components Largest Component Size: 1.96″ Square Body Placement Accuracy: ±0.001″ (0.025mm) Max Placement Rate: 3000 cph Fine Pitch Capability
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