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Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

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Air Compressor Troubleshooting and Solutions

Industry News | 2021-12-08 20:48:30.0

With the development of motor technology, compressor is considered as "general machinery", especially in coal chemical industry, machinery industry and other industries. For distance measurement applications, both incremental and absolute encoders can be chosen - from a technical point of view. The advantages of absolute encoders are reflected in accuracy and performance, while incremental encoders seem more economical and practical. A correctly working compressor determines the safe operation of the whole air conditioner or refrigerator. For example, during the operation of piston compressor, there would be burnout, oiler failure or low pressure and gas shortage. Once these problems occur, the appliance would not work right. How to quickly and accurately detect and solve these problems in time affects the compressor operating rate and product output. This article will analyze all common faults of AC compressors and provide solutions.

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Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

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