Technical Library | 2020-12-29 20:55:46.0
Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, stencil design, circuit board design, via-in-pad design, surface finish, component size, reflow profile, vacuum reflow, nitrogen reflow and other parameters have been varied and voiding quantified for each. The results show some differences in voiding performance with respect to most of these variables but these variables are not independent of each other. Voiding in solder joints is a complex issue that often requires multiple approaches to reduce voiding below required limits. This paper focuses on solutions to voiding for commonly used bottom terminated components (BTCs).
Industry News | 2008-05-18 00:59:26.0
HUDSON, NH � May 13, 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, announces that it is able to measure all types of SMT equipment with its flexible mobile measurement method.
CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)
Industry News | 2011-06-13 18:06:01.0
Practical Components announces that the new Practical Components TMV® (Through Mold Via) 14 mm Board Drop Test Lead-Free Kit is now available. The kit is designed for the 14 mm Amkor TMV® component.
Industry News | 2012-07-23 08:17:40.0
PRIDE Industries, Inc. now can handle board sizes up to 1200 mm with the addition of a JX-100LED from Juki Automation Systems.
Industry News | 2008-08-22 15:07:36.0
A ruggedized power supply for use in demanding avionics applications.
Industry News | 2012-09-12 19:14:47.0
Juki Automation Systems, Inc announces that it will exhibit the FSW510 Selective Solder machine and the KE1080 Placement machine
Industry News | 2002-11-04 13:48:21.0
Strategic acquisition adds a full spectrum of board test and telecom protocol test products and services with a global presence
Industry News | 2015-08-26 18:05:48.0
Vi TECHNOLOGY will exhibit in Booth #808 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Company representatives will demonstrate its complete SMT inspection solutions, including the PI series (SPI), K series (AOI) and Sigma Link software suite.
Industry News | 2020-12-10 17:25:35.0
Altus has announced an exciting new partnership with technology and innovation leader, LPKF. The agreement involves the distribution of LPKF's highly innovative laser-based solutions for the technology industry.
A global industrial auction and valuation business with extensive experience in SMT, PCB Assembly & Manufacturing, Test, Semiconductor and other Electronics Machinery & Equipment.
Manufacturer / Equipment Dealer / Broker / Auctions
896 Main Street
Branford, CT USA
Phone: 203-488-7020
