Industry News | 2013-06-27 08:49:03.0
Chester, Connecticut, USA – Ascentech LLC, North American Distributor for UK-based Aprotec Instrumentation, announces the availability of the Aprotec Z-Check family of solder paste inspection and measurement systems. Z-Check systems are easy-to-use benchtop non-contact SPI measuring systems capable of meeting the needs of today’s demanding PCB production and assembly environment.
Industry News | 2016-09-01 10:54:35.0
Omron Through beam photoelectric sensor E3Z-T61,Industrial automation field is getting improved day by day, many new ideas are introduced every other day, while some are making a great influence on the line of many industry.
Career Center | Santa Ana, California USA | Engineering,Quality Control
General Purpose: This position for a Quality Engineer must have electronics manufacturing and/or cable experience. Your electronics manufacturing background, PCBA, cabling experience, and expertise in auditing and maintaining AS9001 will be the keys
Used SMT Equipment | Repair/Rework
ONYX 29 KEY FEATURES SUMMARY: AXIS MOVEMENTS: All 7 axis motorised, closed loop motion control MANUALMOTION: via integrated hand wheels PC: With Windows based software. UP TO 8 THERMOCOUPLE PORTS: to control process temperatures. AUTOMATIC SIT
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
Used SMT Equipment | Semiconductor & Solar
Kulicke & Soffa ConnX Plus Wire Bonders High Speed Wire Bonder Ball Bonder **NOT LED** 7 available Vintage: 2013 & 2014 Available Extra Large Bond Area: 56mm x 80mm High Speed X-Y-Z Motion Control System +/- 3.0 μm Accuracy CCD V
New Equipment | Rework & Repair Equipment
Standard Features: 600 W - Dedicated Solder Scavenger Heater Dynamic Height Sensing - real time control of scavenger gap Dual Gas Inlets - (CDA & N2 with Two Stage Pressure Regulator) Top Heater Gas Saver - (saves CDA or N2 during preheat) 18
