PCBA Coating Conveyor If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA conformal coating machine, smt coating machine, selective confor
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ETA IR3 Curing Oven Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA conformal coating machine, smt coating machine, selective c
ETA PCBA Conformal Coating Machine If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. PCBA conformal coating machine, smt coating machine, sel
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Inline 3D SPI, Standard Automatic solder paste inspection system As one of the strongest SMT 3D SPI Manufacuturer in China, we provide you all the different models of online solder paste inspection machine,we have variety of size and models of the
New Equipment | Solder Materials
Kapp Golden Flux™ PASTE has been designed specifically for soldering Aluminum to Aluminum and Copper. Kapp Golden Flux™ PASTE stays where you put it. It is designed for use on Aluminum-to-Aluminum or Aluminum-to-Copper sheets and tabs where fluxing a
Technical Library | 2016-10-20 18:13:34.0
Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed circuit board tend to fracture under ball grid array pads when subjected to high strain mechanical loads. In this study, two Pb-free-compatible laminates were tested, plus one dicycure non-Pb-free-compatible as control. One set of these samples were as-received and another was subjected to five reflows. It is assumed that mechanical properties of different materials have an influence on the susceptibility of laminates to fracture. However, the pad cratering phenomenon occurs at the layer of resin between the exterior copper and the first glass in the weave. Bulk mechanical properties have not been a good indicator of pad crater susceptibility. In this study, mechanical characterization of hardness and Young’s modulus was carried out in the critical area where pad cratering occurs using nano-indentation at the surface and in a cross-section. The measurements show higher modulus and hardness in the Pb-free compatible laminates than in the dicy-cured laminate. Few changes are seen after reflow – which is known to have an effect -- indicating that these properties do not provide a complete prediction. Measurements of the copper pad showed significant material property changes after reflow.
Industry News | 2003-04-15 08:23:22.0
Metral TINT back panel receptacles are compatible with standard pin-in-paste SMT processes, eliminating costly secondary assembly operations including heat staking, wave soldering or press fitting.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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