Technical Library | 2006-10-02 14:26:47.0
This paper addresses the assembly and reliability of 0.5 mm pitch leadless Chip Scale Packages (CSP) on .062" immersion Ag plated printed circuit boards (PCB) using Pb-free solder paste. Four different leadless CSP designs were studied and each was evaluated using multiple PCB attachment pad designs.
Used SMT Equipment | THT Equipment
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Used SMT Equipment | Chipshooters / Chip Mounters
Genieses CG110 4988C 2005 Pick and place Configuration: Duel beam with FJ head and FX head with PTF 2005, 11580000 insertions, 10700000 insertions product Tree No: 49402503 GC110 Equip No: 10080575 Volt: 200/240 Amp: 35 Hz: 50/60 Ph: 3 Air: P
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Technical Library | 2007-04-18 19:23:22.0
Recent investigations have revealed that Pb-free solder joints may be fragile, prone to premature interfacial failure particularly under shock loading, as initially formed or tend to become so under moderate thermal aging. Depending on the solder pad surface finish, different mechanisms are clearly involved, but none of the commonly used surface finishes appear to be consistently immune to embrittlement processes. This is of obvious concern for products facing relatively high operating temperatures for protracted times and/or mechanical shock or strong vibrations in service.
Used SMT Equipment | Chipshooters / Chip Mounters
Universal Advantis XS-MF (4985A) Placement Machine (2007) Brand: Universal Instruments Corporation Model: Advantis XS-MF Product Code: 4985A Year: 2007 Serial #: 10091455 Single-lane; Left-to-right Single-gantry, Single beam (linear motor)
Used SMT Equipment | Chipshooters / Chip Mounters
Universal Genesis GX-11S (4992B) Placement Machine (2008) Brand: Universal Instruments CorporationModel: Genesis GX-11SProduct Code: 4992BYear: 2008Serial #: 10095079Product Tree #: 51194202 GSXB033 Software Version: UPS+ 7.4.0.1Single Gantry, Single
Used SMT Equipment | Pick and Place/Feeders
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Technical Library | 2007-09-27 16:18:15.0
Considerable interest exists in the process known as the pinin- paste, or the Alternative Assembly and Reflow Technology (AART) process. The AART process allows for the simultaneous reflow of both odd-form and through hole devices as well as surface mount components. This process has several advantages over the typical mixed technology process sequence that includes wave soldering and/or hand soldering, often in addition to reflow soldering.
Technical Library | 2007-03-28 10:18:33.0
Legislation against the use of lead in electronics has been the driving force behind the use of lead-free solders, surface finishes, and component lead finishes. The major concern in using lead-free solders in the assembly and rework Chip Scale Packages (CSPs) is the relatively high temperatures that the components and the boards experience. Fine-pitch CSPs have very low standoff heights following assembly making inspection and rework of these components more difficult. One other concern pertinent to rework is the temperature of the neighboring components during rework. These issues, coupled with the limitations of rework equipment to handle lead-free reflow temperatures, make the task of reworking lead-free assemblies more challenging.
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