Electronics Forum | Tue Jan 30 09:31:08 EST 2007 | russ
these assemblies getting depaneled? ICT? any fixtures or anything? I would check your print and placement equipment and make sure there are no support issues as well. But I believe you mentioned fractures so that would be happening after the reflow
Electronics Forum | Wed Jun 30 00:20:08 EDT 2010 | leadthree
Thanks for your reply. This production lot is already finished. We produced in 2 lots, first was no-clean (and was ok), 2nd lot was cleaned (aqua based), and I need to look into the cleaning further. Since it's all finished I can't get parts from se
Electronics Forum | Sat Mar 10 08:05:09 EST 2007 | davef
Here's your test definitions [clipped from the dictionary in the fine SMTnet Library]: * Test, Automated. Computer controlled electrical testing of parts, assemblies, or finished products. * Test, Built-In (BIT). An electrical testing technique whi
Electronics Forum | Fri Mar 30 11:04:24 EST 2001 | genny
We are already using ICT on the PCB, which should catch most missing components, also components installed backwards, or the wrong value(to a point - we do RF so we have lots of very small value caps and inductors which can't be measured), and in som
Electronics Forum | Fri Jul 23 10:16:16 EDT 1999 | Boca
| | | Dear all | | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | | Our appliocation is Mainly fabrication of mother boards. | | | Thanks | | | | | In theory, ICT is the classical answer (In-Ci
Electronics Forum | Mon Mar 12 08:24:30 EDT 2007 | rgduval
ICT is generally a manufacturing verification test. Coverages vary depending on the board. I've run lots with as low as 25% coverage on the board (but produced 98% FPY post board assembly). Functional test is exactly what it sounds like. Checking
Electronics Forum | Mon Mar 12 08:06:44 EDT 2007 | davef
Q1.� is it mondatory to test all components and paths in the PCBA; and check all soldering joints? A1. Nothing is mandatory. You do ICT to prove some component functionality and check manufacturing process. ICT test coverage is driven by factors i
Electronics Forum | Fri Oct 16 17:01:21 EDT 1998 | Justin Medernach
| | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | Q: Can you get
Electronics Forum | Sat Oct 17 10:24:12 EDT 1998 | smd
| | | | | | | It seems like most people want to X-Ray their BGAs. We're going to start doing a lot more of them and need to consider X-ray, too. | | | | | | | Q: Do most people/companies X-ray everyBGA or do they just do SPC? | | | | | | | Q: Can yo
Electronics Forum | Mon Aug 24 18:34:31 EDT 1998 | Steve Evers
| Any competition for Teradyne on this front? Any users out there with comments? | Thanks in advance. | G If your new to the world of Fying Probe ICT you may think this is a new developement. Its not, this technology has been around for 10+ years. M
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