.8mm and bga - SMT Electronics Manufacturing

Events Calendar: .8mm and bga (Page 1 of 1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Webinar: BGA Reballing - Theory and Hands On

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,

Webinar: BGA Reballing - Theory and Hands On

Surface Mount Technology Association (SMTA)

Webinar: BGA and Area Array Process Defects - Causes & Cures

Events Calendar | Tue Feb 12 00:00:00 EST 2019 - Tue Feb 12 00:00:00 EST 2019 | ,

Webinar: BGA and Area Array Process Defects - Causes & Cures

Surface Mount Technology Association (SMTA)

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Events Calendar: .8mm and bga (Page 1 of 1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Webinar: BGA Reballing - Theory and Hands On

Webinar: BGA and Area Array Process Defects - Causes & Cures

.8mm and bga searches for Companies, Equipment, Machines, Suppliers & Information