Events Calendar: bga void specification ipc (Page 1 of 1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Webinar: BGA Reballing - Theory and Hands On

Events Calendar | Tue Feb 19 00:00:00 EST 2019 - Tue Feb 19 00:00:00 EST 2019 | ,

Webinar: BGA Reballing - Theory and Hands On

Surface Mount Technology Association (SMTA)

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bga void specification ipc searches for Companies, Equipment, Machines, Suppliers & Information

Association Connecting Electronics Industries (IPC)
Association Connecting Electronics Industries (IPC)

IPC is the trade association for the printed wiring board and electronics assembly industries.

Training Provider / Events Organizer / Association / Non-Profit

3000 Lakeside Drive, 309 S
Bannockburn, IL USA

Phone: 847-615-7100

Best SMT Reflow Oven

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Wave Soldering 101 Training Course
2024 Eptac IPC Certification Training Schedule

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