Events Calendar: dross from solder (Page 1 of 5)

i4.0 Connect Forum

Events Calendar | Wed Oct 02 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | Fremont, California USA

i4.0 Connect Forum

Heller Industries Inc.

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Surface Mount Technology Association (SMTA)

SMTA Dallas Chapter - Understanding Selective Solder Technology

Events Calendar | Fri Jan 11 00:00:00 EST 2019 - Fri Jan 11 00:00:00 EST 2019 | Richardson, Texas USA

SMTA Dallas Chapter - Understanding Selective Solder Technology

Surface Mount Technology Association (SMTA)

Solder Paste Qualification Testing - SMTA Webinar

Events Calendar | Wed Mar 07 00:00:00 EST 2018 - Wed Mar 07 00:00:00 EST 2018 | ,

Solder Paste Qualification Testing - SMTA Webinar

Surface Mount Technology Association (SMTA)

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Events Calendar | Mon Apr 12 00:00:00 EDT 2021 - Mon Apr 12 00:00:00 EDT 2021 | ,

Europe Chapter Webinar: Tombstoning Components during Reflow Soldering - Causes & Cures

Surface Mount Technology Association (SMTA)

Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability

Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,

Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability

Surface Mount Technology Association (SMTA)

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Events Calendar | Mon Dec 02 00:00:00 EST 2019 - Mon Dec 02 00:00:00 EST 2019 | ,

Webinar: QFN/LGA Design, Assembly Process Issues & Reliability Failures

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data

Events Calendar | Thu Jan 10 00:00:00 EST 2019 - Thu Jan 10 00:00:00 EST 2019 | Manassas, Virginia USA

SMTA Capital Chapter: Operation of a Vacuum Reflow Oven with Preliminary Void Reduction Data

Surface Mount Technology Association (SMTA)

San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA

Events Calendar | Mon Jun 10 00:00:00 EDT 2024 - Mon Jun 10 00:00:00 EDT 2024 | Carlsbad, California USA

San Diego Chapter In-Person Event: IPC J-STD-001 Compliant Solder Pattern Calculations for DFA

Surface Mount Technology Association (SMTA)

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