Events Calendar: ground pad solder void (Page 1 of 1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology

Events Calendar | Wed May 31 00:00:00 EDT 2023 - Wed May 31 00:00:00 EDT 2023 | Holtsville, New York USA

Long Island Chapter Meeting: Fine Feature Paste Printing, Stencil Design and Solder Technology

Surface Mount Technology Association (SMTA)

Free Vacuum Reflow Workshop

Events Calendar | Tue Nov 05 00:00:00 EST 2019 - Tue Nov 05 00:00:00 EST 2019 | North Billerica, Massachusetts USA

Free Vacuum Reflow Workshop

BTU International

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