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IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Webinar: The IPC Digital Twin Standard

Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,

Webinar: The IPC Digital Twin Standard

Surface Mount Technology Association (SMTA)

Corporate Crisis and Security Forum

Events Calendar | Wed Mar 01 07:00:00 EST 2017 - Thu Mar 02 11:00:00 EST 2017 | Dallas, Texas USA

Corporate Crisis and Security Forum

Manufacturers Alliance for Productivity and Innovation (MAPI)

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head 1 searches for Companies, Equipment, Machines, Suppliers & Information

Electronics Equipment Consignment

High Precision Fluid Dispensers
2024 Eptac IPC Certification Training Schedule

Best Reflow Oven
Online Equipment Auction Jabil Monterrey MX Aug 19, 2024

High Resolution Fast Speed Industrial Cameras.
PCB Handling with CE

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
Electronic Solutions R3

Thermal Transfer Materials.