Events Calendar: head 1 (Page 1 of 1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Webinar: The IPC Digital Twin Standard

Events Calendar | Thu Apr 08 00:00:00 EDT 2021 - Thu Apr 08 00:00:00 EDT 2021 | ,

Webinar: The IPC Digital Twin Standard

Surface Mount Technology Association (SMTA)

Corporate Crisis and Security Forum

Events Calendar | Wed Mar 01 07:00:00 EST 2017 - Thu Mar 02 11:00:00 EST 2017 | Dallas, Texas USA

Corporate Crisis and Security Forum

Manufacturers Alliance for Productivity and Innovation (MAPI)

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head 1 searches for Companies, Equipment, Machines, Suppliers & Information

Pillarhouse USA for handload Selective Soldering Needs

Training online, at your facility, or at one of our worldwide training centers"
High Throughput Reflow Oven

Easily dispense fine pitch components with ±25µm positioning accuracy.
convection smt reflow ovens

Software programs for SMT placement and AOI Inspection machines from CAD or Gerber.
Selective soldering solutions with Jade soldering machine

High Precision Fluid Dispensers