Events Calendar: lead free tinning wires (Page 1 of 2)

SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial

Events Calendar | Thu Jun 14 00:00:00 EDT 2018 - Fri Jun 15 00:00:00 EDT 2018 | ,

SMT Process Fundamentals for Tin-Lead and Lead Free Assembly - SMTA Webtorial

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Events Calendar | Tue Apr 06 00:00:00 EDT 2021 - Tue Apr 06 00:00:00 EDT 2021 | ,

Capital Chapter Webinar: Next Gen Lead Free Solders for High Reliability & SMT Yield improvement

Surface Mount Technology Association (SMTA)

Printed Circuit Board (PCB) Inspection & Quality Control

Events Calendar | Mon Sep 14 00:00:00 EDT 2020 - Mon Sep 14 00:00:00 EDT 2020 | ,

Printed Circuit Board (PCB) Inspection & Quality Control

Surface Mount Technology Association (SMTA)

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Events Calendar | Mon Mar 16 00:00:00 EDT 2020 - Mon Mar 16 00:00:00 EDT 2020 | ,

BGA & Area Array Failures, Causes & Corrective Actions Online Webinar

Surface Mount Technology Association (SMTA)

Hand Soldering & De-Soldering with Lead-Free Solder - Webinar

Events Calendar | Mon Nov 19 00:00:00 EST 2018 - Mon Nov 19 00:00:00 EST 2018 | ,

Hand Soldering & De-Soldering with Lead-Free Solder - Webinar

Surface Mount Technology Association (SMTA)

Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability

Events Calendar | Thu Oct 21 00:00:00 EDT 2021 - Thu Oct 21 00:00:00 EDT 2021 | ,

Great Lakes Chapter Webinar: Low Melting Alloy & Selection of the Right Chemistry for Reliability

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board

Events Calendar | Mon Feb 19 00:00:00 EST 2024 - Mon Feb 19 00:00:00 EST 2024 | ,

SMTA Webinar: Development of Wireless Strain Measurement for Printed Circuit Board

Surface Mount Technology Association (SMTA)

Upper Midwest Expo & Tech Forum

Events Calendar | Tue Jun 04 00:00:00 EDT 2024 - Tue Jun 04 00:00:00 EDT 2024 | St. Paul, Minnesota USA

Upper Midwest Expo & Tech Forum

Surface Mount Technology Association (SMTA)

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