Events Calendar: qfn thermal pad solder paste (Page 1 of 1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

  1  

qfn thermal pad solder paste searches for Companies, Equipment, Machines, Suppliers & Information

pressure curing ovens

Software for SMT placement & AOI - Free Download.
pressure curing ovens

Best Reflow Oven
High Throughput Reflow Oven

Easily dispense fine pitch components with ±25µm positioning accuracy.
Professional technical team,good service, ready to ship- Various brands pick and place machine!

Internet marketing services for manufacturing companies