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IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

Aguascalientes Expo and Tech Forum

Events Calendar | Thu Jun 01 00:00:00 EDT 2023 - Thu Jun 01 00:00:00 EDT 2023 | Aguascalientes, Mexico

Aguascalientes Expo and Tech Forum

Surface Mount Technology Association (SMTA)

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Events Calendar: seho and go and selective and 2 (Page 1 of 1)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Aguascalientes Expo and Tech Forum

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