Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Wed Dec 06 00:00:00 EST 2017 - Wed Dec 06 00:00:00 EST 2017 | San Jose, California USA
Technology Seminar - a new low melting point solder alloy that improves quality, lowers costs and maximizes equipment efficiency
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