Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,
IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2
Events Calendar | Wed Apr 21 00:00:00 EDT 2021 - Wed Apr 21 00:00:00 EDT 2021 | ,
Oregon Chapter Tutorial: How Clean is Clean and How Do You Know for Sure?
Events Calendar | Sun Sep 10 00:00:00 EDT 2017 - Wed Sep 13 00:00:00 EDT 2017 | Warsaw, Poland
EMPC 2017 - 21st European Microelectronics and Packaging Conference and Exhibition
International Microelectronics Assembly and Packaging Society (IMAPS)
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