Events Calendar: vias in pad (Page 1 of 1)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Events Calendar | Thu Oct 03 00:00:00 EDT 2019 - Thu Oct 03 00:00:00 EDT 2019 | ,

IPC Tech Ed Webinar Series: Ball Grid Array (BGA) and Bottom Termination Component (BTC) Design and Assembly Challenges: Reflow Profiling to Achieve Low Defect Rates and Successful Assembly! – Part 2

Association Connecting Electronics Industries (IPC)

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vias in pad searches for Companies, Equipment, Machines, Suppliers & Information

Selective Soldering Nozzles

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High Throughput Reflow Oven

High Resolution Fast Speed Industrial Cameras.
SMT feeders

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
2024 Eptac IPC Certification Training Schedule

Software for SMT placement & AOI - Free Download.


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