New Equipment | Board Handling - Conveyors
Model No: KUSN 250L Automatic Single Magazine Un loader PCB loading time: Approx 6seconds Magazine change-over time: Approx 30 seconds Power supply: 100-230V AC (customized ), single phase, MAX 300V/A Air pressure: 4-6 bar, MAX 10L/minute Transp
Affordable Manufacturing Execution System (MES), Shop Floor Automation and Integration Software CELLS WORKFLOW Product Tracking MES is an affordable full Manufacturing Process Control Software System providing Plant Intelligence for any industry.
AOI - Xray - Paste Inspection - Yestech, Viscom, Omron, MVP, Cyber Optics, GSI Lumonics AOI-Xray-Paste Inspection for sale at JMW Enterprises.
Feature : Made by FUJI Machine MFG. Part Name: Motor Feeder W32 32mm FMB-32E-380. Part Number: AKDFA-6100 KDE-3200. For FUJI IP1 IP2 IP3 QP242E QP3 XP2 Electronics Assembly Equipment. Brand : FUJI Unit : PC(s)
Waterjet allows for improved cutting tolerances, improved lead times and the ability to provide highly complex geometry. Using a stream of water with forces of 55,000 PSI yields fast production rates and tool free cutting. Our single head and 4-head
We offer a wide selection of the Juki SMT Nozzles, Tooling, & Consumables. We also offer custom engineering to standard nozzles for odd shaped components. Count On Tools has been a manufacturer of high quality, low cost nozzles and associated compo
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
_1.jpg)
YAMAHA NOZZLE SERIES Brand Model Specification Material of nozzle tip YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Tungsten steel YAMAHA YV100II 31#NOZZLE 0402 / 0603 / 0805 (X) Diamond steel YAMAHA YV100II 32#NOZZLE For IC of tiny size Tungst
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
winsouce.jpg)
.gif)
