New SMT Equipment: /pga (Page 1 of 10)

BGA/PGA Assembly

New Equipment |  

Assembly of BGA/PGA on ceramic or laminate

EMS Microelectronics Division

PGA Sockets and Adapters

New Equipment |  

Hundreds of standard and interstitial footprints. Many terminal and wafer options including Peel-A-Way� low-profile, removable carriers and high temperature molded wafers.

Advanced Interconnections Corporation

1109 20GHz TDR Tester

New Equipment |  

1109 20GHz TDR Tester Product Classification: TDR Method Impedance Tester for High Speed, High Frequency Boards Product Description: The 1109 20GHz TDR Tester provides a test head equipped with dedicated high-frequency probes for TDR measurement w

HDI Solutions Inc.

AMTECH Tacky Paste Fluxes

AMTECH Tacky Paste Fluxes

New Equipment | Solder Materials

AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t

AMTECH

BSDL Verifier

BSDL Verifier

New Equipment | Test Equipment

Using a sample boundary-scan IC, the JTAG Technologies BSDL generation/verification system automatically verifies the existing BSDL (Boundary-Scan Description Language) file or creates a BSDL file for the device if none exists, all in accordance with

JTAG Technologies B. V.

TI New and Origina PGA2500IDBR in Stock  IC SSOP28, 2014+  package

TI New and Origina PGA2500IDBR in Stock IC SSOP28, 2014+ package

New Equipment | Assembly Services

TI New and Origina PGA2500IDBR in Stock  IC SSOP28, 2014+  package PGA2500IDBR Gain range: 0dB and 10dB to 65dB (1dB steps) Today's Hot Deals:  BC847PNQ-7-F SOT363 DIODES 22+ MAX96716AGTM/VY+T QFN MAXIM 21+ PIC18F4520T-I/PT TQFP44 MICROCHIP 20+

Shenzhen Fuwo Technology Co.,Ltd

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

RE-7500

RE-7500

New Equipment | Printing

- Flexible uses for all different kinds of Components like SMD, BGA, CBGA, CCGA, CSP, QFN, MLF, PGA and All Epoxy undefiled BGA .. etc . - Recommended for reworking All Plastic parts, PTH, Sockets, Connectors and Metal Shields . - Complete reworking

Jovy Systems Limited

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