New SMT Equipment: .012 (Page 4 of 2376)

Fuji CP-643E Chip Shooter

New Equipment |  

Machine details: Back device table doors installed. New Type of Nozzle Holder Shaft Assembly. Machine Software Version: V1.27 Machine Vision Software Version: V3.00 Machine Mfg Date: NOV. 1999 Machine Working Hours: 15,024 Type/Quantity of noz

Used Machine Dealers

CONCO Antistaitc Lab Chairs ESD work chair

CONCO Antistaitc Lab Chairs ESD work chair

New Equipment | ESD Control Supplies

Antistatic ESD PU Foam Chair COS- 012 SPECIFICATION; 1.Size:  410*400mm(chair seat) 360*250mm(chair back) 2.Material: ESD PU Foam 3.Height adjustable about 530-780mm ( with 220mm adjustable pneumatic rod) 4.Surface resistance: 10e6~10e9 ω. 5.Sy

CONCO

4L 1.2mm ENIG

4L 1.2mm ENIG

New Equipment |  

1) 4 layers board, 1.2mm thickness 2) Min. track width: 0.13mm 3) Min. track space: 0.12mm 4) Min. hole size: 0.3mm 5) Finish: immersion gold

Bicheng Enterprise Company

14-layer PCB with 3 Mils Minimum Line Width/Space, Made of FR4 Material

14-layer PCB with 3 Mils Minimum Line Width/Space, Made of FR4 Material

New Equipment | Assembly Services

1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Test voltage: 50 to 300V

Shenzhen Linghangda Electronic Co.,Ltd

High-density multi-layer PCB with 3 Mils Minimum Line Width

High-density multi-layer PCB with 3 Mils Minimum Line Width

New Equipment | Assembly Services

1,012 (normal) Electric strength: >1.3kV/mm Thermal stress: 288°C, 20 seconds Testing voltage: 50 to 300V Packing: vacuum packing for PCB, and good condition outer boxes

Shenzhen Linghangda Electronic Co.,Ltd

Golden Finger PCB

Golden Finger PCB

New Equipment | Fabrication Services

Project Description | Parameters 10 Layer  Thickness: 1.6+/-0.16 mm Min Hole Size: 0.15 mm Width/Space: 0.12mm/0.1 mm Surface Treatment: ENIG+Gold Finger | Craft Red Ink Gold Finger | Application Industrila Control

Headpcb

High Thermal Conductivity Heavy Copper Board

High Thermal Conductivity Heavy Copper Board

New Equipment | Prototyping

Project Description  | Parameters 16 Layer  Thickness: 3.8+/-0.03 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Material: SY ST115 Thermal Conductive:1.5W/m.k Back drilling, laser drilling | Application Electronic Power 

Headpcb

Castellated Holes PCB

Castellated Holes PCB

New Equipment | Fabrication Services

Project Description | Parameters 4 Layer Thickness: 1.8+/-0.18 mm(High Tg S1000-2 Material) Min Hole Size: 0.2 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Castellated Holes High Tg S1000-2 Material | Application Automobile

Headpcb

12 Layer Back Drill PCB

12 Layer Back Drill PCB

New Equipment | Through-Hole

Project Description | Parameters 12 Layer  Thickness: 2.4+/-0.24 mm Min Hole Size: 0.25 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Black Drill 12 Layer | Application Consumer Electronics

Headpcb

Flexible PCB connector

Flexible PCB connector

New Equipment | Cable & Wire Harness Equipment

Project Description | Parameters 4 Layer (1R+2F+1R) Thickness: 0.56+/-0.1 mm Min Hole Size: 0.3 mm Width/Space: 0.15mm/0.12 mm Surface Treatment: ENIG | Craft Black Ink Rigid-Flex Board | Application Consumer Electronics

Headpcb


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