Our Assembly factory could perform reliable manufacturing services for : Surface Mount PCB assembly ; Through hole assembly ; 0201 to 44mm2 - BGA, micro BGA, CSP, fine pitch QFP ; Automated pick and place ; Placement rate - 24,000 cph ; Hand build ;
Smt feeder Yamaha feeder CL8X4 P/N: KW1-M1200-00X, P/N: KW1-M1100-000, NEW The depth of groove for the material is 2.5mm. 4mm Pitch (Sprocket), Tape guide 8X4 (0603,0805)
New Equipment | Rework & Repair Equipment
Visit PSI's main BGA Reballing Services page for more information. PSI has over 20 years experience reballing BGA devices of every size, pitch, and package style: micro-BGAs Alloy conversion from Sn/Pb to Pb-free, or Pb-free to Sn/Pb Reclaim a
X-KAR� Brand provides Rework/Repair and SMT Assembly Equipment for assembly and repair of PCB's with Surface Mount Technology Components. Rework equipment handles all standard parts plus fine pitch QFP, BGA, CSP. SMT Rework Packages include: Hot Ai
New Equipment | Rework & Repair Services
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb
YAMAHA FEEDER CL12mm (KW1-M2200-300) FEEDER CL12mm 12×4, 12×8, 12×12 The depth of groove for the material is 7.0mm 4mm Pitch (SPROCKET) YAMAHA CL feeder Suilt for YAMAHA YV88L, YV88XG, YV88X, YV100, YV100II, YV100X, YV100G, YG200, Xg180, PHILIPS
placement machines range from the full-featured, entry level priced, 96 feeder MY9 to the high mix, high volume, 240 feeder MY19. Mydata is famous for flexibility, high mix, ease-of-use, and fast programming yet can place up to 21,000 CPH with the 8
Direct tray, modular, and multi-functional placement. 5,140 cph. 54 8mm reels. 40 trays. The Panasonic DT401 is a direct tray modular, multi-functional placement machine that's designed to give users the flexibility to place a large number of varie
CAT90-M is a manual pick and place system featuring the latest high resolution vision technology. The system is designed for placement of various SMT components such as capacitors, resistors, SOIC’s, fine-pitch QFP’s, and many other SMD’s. Components
The Sniper III is the latest in BGA and Micro BGA Rework system design. With On-Board control and powerful computer profile generation, including data logging. The system also includes a Thermalcouple Bank to develop the rework profile and monitor th