New Equipment | Test Equipment
Koh Young KY8080 3D SPI Min component: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:600kg Product description: Koh Young KY8080 3D SPI, Min component: 01005, PCB size:350x330mm, weight:600kg, Dimension:1000x1335x1627mm Koh Young KY808
The 3rd-generation M3 multi-function chip mounter implements high speed, stability and accuracy operation. The system meets the high-density, miniaturization, multi-encapsulation, large capacity, high precision characteristics requirement of LED fiel
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Rework & Repair Equipment
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Optical aligment bga rework station WDS-700 automatic mobile phone repair machine for galaxy note 4 emmc
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Hottest professional mobile phone repair machine WDS-700 auto bga chipset rework station with free training
YSC Scope (Model YSC-70, YSC-130 and YSC-7014) with integrated LED lighting and camera are ideal for BGA, CSP and QFP inspection. Interchangeable 90 degree horizontal viewing prism tips from 0.5 mm to 2.0 mm size can be used for various stand off hei
New Equipment | Rework & Repair Equipment
No need of nozzles, no airflow during re-flow process. Use non-contact infrared temperature sensor to measure temperature real-timely, and achieve closed loop control of temperature during rework process, especially suitable for lead free process.
TP45N can release all SMD units including 0201 ,SOIC PLCC BGA to QFPIC(o.5mm foot spacing) ��Automatic centering system: The 4 side claws can fit for all SMD component like 0402, SOIC, PLCC��QFP IC�� ��High precision pole system ��Vision centering s
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Sole manufacturer WDS-700 automatic optical alignment mobile phone BGA rework station with HD camera Our
New Equipment | Rework & Repair Services
Specifications: 1.WDS-700 bga rework station 2.Optical alignment 3.Automatic machine 4.MCGS touch screen 5.CE,ISO passed 6.Small size Sole manufacturer WDS-700 automatic mobile phone BGA rework station for iphone / samsung /HTC motherboard wi
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