New Equipment | Solder Materials
1.00” (25.4mm) +/-0.040” (1.010mm) Thickness Error 0.001” (0.025mm) +/-0.0002” (0.0050mm) 0.0010” - 0.002” (0.025mm-0.050mm) +/-0.0003” (0.0076mm)
Our fully automated silicon wafer dicing service consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems, we know that a good wafer dicing or wafer cutting process sets the pace for all rema
Electronic board size: maximum: 457*356mm; minimum: 50*50mm Electronic board thickness: 0.3 - 4.0mm Component type: front side: the largest 40 species; rear side: 10 kinds of 10 layers / 20 kinds of 10 layers Board loading time: 4.2 seconds Mount
Cuts & bends each side of an axial components to 90° for horizontal mount (flushmount) configuration. F-1 is a handcrank unit Fast, rotary machine (26 components per revolution) Quick and easy set-up Optional Reel Holder available (RH-1) Opti
Our range includes board to board and cable to board connectors in a variety of high-reliability, high performance interconnect styles, and industry standard interconnect. Harwin connectors are available from our global distribution network. Harwin
Inspection and Data Creation Tool for the Stencil / Screen Fabrication Industry. World's leading solder paste stencil & emulsion screen inspection system. Used by both stencil/screen fabricators and users to detect errors BEFORE production, elimina
Syagrus Systems uses the 3M Wafer Support System to meet the demands of today's technology companies for extremely thin silicon wafers and die used in complex applications. We have over 15 years of silicon wafer thinning and wafer backgrinding experi
InspectScan VPI is a fully integrated, stand-alone process control, measurement and inspection and programming workstation for use in setting up processes before the production floor in the PCB or Hybrid Microcircuit assembly industries. InspectScan
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