New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
Dual Lane SMT Reflow Oven Nitrogen soldering process dual rail conveyor Weight Appx.:3060Kg Dimension 6300*1680*1530mm Product description: 10 Zones Dual Rail Nitrogen SMT Reflow Oven KTR-1000D-N Manufacturer, Nitrogen soldering process, dual
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. High efficiency multi cutter PCB depeneling machine can directly connect the reflow oven and pick and the pick and place machine on the SMT production line. Th
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. At the same time, the minimum cutting length can achieve 100mm and no limits of the cutting length. High efficiency multi cutter PCB depeneling machine's minimu
ASCEN technology specializing the PCB assembly equipment and the SMT solution. Please check the more detail link : www.pcb-separator.com Any inquiry please sent the email to : info@pcbasc.com , and add the Skype NO.: supplier889 This is our mult
ASCEN 900 model PCB depaneling machine is very popular use for cutter plate,especially in the LED lamp production line.Multi cutter PCB depanelizer can depaneling the whole LED panel at one time. It is different from our single cutter model(ASC-7
New Equipment | Test Equipment
Hanwha SM482 Plus SMT Assembly Line Hanwha SM482 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:30000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach
ASCEN 900 model PCB depaneling machine with high precision and high efficient, it is very popular use for LED assembly production line. Mcutter PCB depanelizer can depaneling the whole LED panel at one time. It is different from our single cutter
New Equipment | Test Equipment
Koh Young KY8030-3 3D Inline SPI component Range: 01005 PCB size:350x330mm Dimension:1000x1335x1627mm weight:800kg Product description: Koh Young KY8030-3 3D Inline SPI, component Range: 01005, PCB size:350x330mm, Dimension:1000x1335x1627mm, weight:
New Equipment | Assembly Services
No. Items technological Capability 1 Layer 1-20 layer 2 Copper thickness 0.5-4.0oz 3 Board thickness 0.2mm-6.0m
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