New Equipment | Test Equipment
Koh Young ZENITH Alpha UHS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 12M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 4mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330m
New Equipment | Test Equipment
Koh Young ZENITH Alpha 3D AOI chip range: 01005 PCB size:330x330mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x330mm, Dimension:820x1265x1627mm, weight:550KG Koh Young Z
New Equipment | Test Equipment
Koh Young ZENITH Alpha HS+ 3D AOI chip range: 01005 PCB size:330x330mm Cameral resolution: 8M 15μm, Inspection height: 25mm Dimension:820x1265x1627mm weight:550KG Product description: Koh Young ZENITH Alpha 3D AOI, chip range: 01005, PCB size:330x33
Perfectly suited for multi-layer, high aspect ratio, and high-Tg boards. For PCB UC/ST - series Diameter: ø0.20 ~ ø0.55mm PCB UC/ST Series drills are designed for the PCB market and are highly rigid. Diameter (D) Flute
8 layers board Basic Material: FR-4 Board Ply (thickness): 1.80mm Measurement: 254mm x 304.8mm Conductor Width: 5mil (0.13mm) Conductor Spacing: 5mil (0.13mm) Surface Treatment: Immersion gold File Format: Gerber File (RS274X) Through Hole: 2
BDC F/D Series shanks made by specially chosen high hardness and rigid stainless steel. Performance much higher than general composite routers and much closer to solid routers. Composite type - Diamond Cut Diameter (D) Flut
EV800-2S0004G 0．4 EV800-2S0005G 0．55 EV800-2S0007G 0．75 EV800-2D0011G 1．1 EV800-2D0015G 1．5 EV800-2T0022G 2．2EV800-4T0004G 0．4 EV800-4T0005G 0．55 EV800-4T0007G 0．75 EV800-4T0011G 1.1 EV800-4T0015G 1．5 EV800-4T0022G 2．2 EV800-4T0030G 3.0 E
New Equipment | Solder Materials
NC676 No Clean Solder Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time
New Equipment | Solder Materials
WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of
